Plating Thickness

Plating thickness testing measures the depth of surface plating applied to the specimen. It is also used to measure the depth of nitrating, or white layer, on the specimen surface.

Plating thickness testing measures the depth of surface plating applied to the specimen. It is also used to measure the depth of nitrating, or white layer, on the specimen surface. 

 

A cross-section of the specimen is mounted, polished and etched. Next a photomicrograph is made at a magnification sufficient to allow accurate measurement of the surface plating. Plating thickness tests ensure the plating process conforms to drawing and specification callouts.

 

Copper, nickel electroplating and chemical deposition may all be measured via the plating thickness test. 

 

Plating thickness testing is carried out per manufacturer's drawings or specifications. 

 

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